The Next-Gen RK3588 Core board
Powerful, AI-Driven, High-Performance.Shop Now>
The Portworld YC-Core3576 represents a compact system-on-module (SoM) engineered around the Rockchip RK3576 processor. With dimensions of merely 38 × 38 mm, this module consolidates an octa-core CPU, Mali-G52 graphics capabilities, AI acceleration functionality, and multimedia processing capabilities into a streamlined form factor specifically designed for embedded devices and edge computing implementations.
Features include a 240-pin board-to-board connector, integrated power management circuitry, and an optimized PCB layout. The YC-Core3576 addresses the requirements of product developers seeking robust processing capabilities in applications where space constraints, power design efficiency, and integration expenses are critical considerations.
Understanding the YC-Core3576
The YC-Core3576 functions as an embedded computing core board that establishes the primary processing foundation for specialized electronic products. This module can be paired with a carrier board to incorporate application-specific interfaces, power distribution connections, peripheral components, and mechanical mounting infrastructure.
The Rockchip RK3576 System-on-Chip (SoC) forms the computational heart of this platform, employing a big.LITTLE octa-core configuration comprising four Cortex-A72 processor cores operating at frequencies up to 2.2 GHz and four Cortex-A53 processor cores operating at frequencies up to 1.8 GHz, as documented in the official product specifications.
This processor architecture delivers computational resources suitable for embedded applications requiring integrated user-interface functionality, communication protocols, multimedia processing operations, and application-specific logic execution. NEON acceleration technology further enhances performance for compatible ARM-based computational tasks.

Key Features of the YC-Core3576 Core Board
The YC-Core3576 integrates advanced processing capabilities within a minimal physical form factor. Its principal specifications encompass:
Rockchip RK3576 processor: An eight-core CPU architecture featuring four Cortex-A72 cores and four Cortex-A53 cores.
Compact 38 × 38 mm footprint: A space-efficient design suitable for embedded applications requiring constrained internal dimensions.
240-pin BTB connector: A board-to-board interface engineered to facilitate connection between the core module and a purpose-built carrier board.
Integrated AI NPU: Facilitates INT4, INT8, and FP16 inference operations for applicable models and software frameworks.
AI development compatibility: TensorFlow and PyTorch integration is available within designated deployment frameworks; model conversion, runtime compatibility, and hardware acceleration capabilities should be assessed for individual implementations.
Mali-G52 GPU: Delivers graphics processing functionality for embedded user interfaces and multimedia operations.
4K@120fps video decoding: Enables high-resolution video processing, contingent upon codec support, software configuration, and output specifications.
16 MP ISP: Facilitates image-processing operations for compatible camera modules and image-sensor interfaces.
12-layer gold PCB: Engineered with consideration for signal integrity, electromagnetic compatibility, and thermal dissipation.
Single 5V power input: The integrated RK806S-5 PMIC is engineered to streamline power distribution architecture and minimize carrier-board component requirements.
Actual performance and feature availability are contingent upon board revision, memory specifications, software implementation, carrier-board architecture, and peripheral configurations.

How the YC-Core3576 Facilitates Edge Artificial Intelligence Implementation
Edge artificial intelligence systems frequently require processing information at the point of origin while adhering to stringent constraints regarding physical dimensions, energy consumption, and overall system expenses. A compact system-on-module can streamline the creation of such systems by consolidating essential processing capabilities into a unified module that interfaces with application-specific circuitry.
The YC-Core3576 integrates central processing unit computation, graphical rendering, image analysis, and an artificial intelligence neural processing unit within a 38 × 38 millimeter footprint. Within an appropriately configured system architecture, the central processing unit can oversee application functionality and data transmission, the graphics processing unit can execute compatible graphical operations, the image signal processor can manage compatible camera data, and the neural processing unit can optimize compatible neural network computations.
This integration proves valuable for intelligent imaging systems, automated visual inspection equipment, smart interface devices, compact automation systems, and portable multimedia applications. Artificial intelligence performance is contingent upon the computational model, inference execution framework, data quantization methodology, runtime environment, and software enhancements implemented in the finished product.
Why the 38 × 38 Millimeter Form Factor Holds Significance
Module dimensions represent a critical factor in embedded system development. Reduced-size computing modules offer enhanced design flexibility when developing space-constrained enclosures, integrated control apparatus, mobile devices, and applications with restricted circuit board area.
The YC-Core3576's 240-pin module-to-carrier connection interface permits the module to be integrated with a carrier board customized for particular application specifications. Manufacturers can establish the necessary peripheral connectivity options, mechanical configuration, power distribution architecture, and interface connectors at the carrier-board stage.
The incorporated RK806S-5 power management integrated circuit and 5-volt input architecture can further facilitate power system simplification. Realized cost reductions depend on the carrier-board design, component procurement decisions, power consumption specifications, and manufacturing scale.
Applications of the YC-Core3576
The YC-Core3576 is suitable for deployment in smart cameras and machine vision systems, where compatible camera sensors and image-processing software can be integrated with on-device computing capabilities and artificial intelligence inference functionality.
Within industrial embedded systems, its minimal footprint facilitates incorporation into control units, surveillance systems, and specialized application terminals. The underlying hardware architecture must be engineered to accommodate the environmental, thermal, electrical, and dependability specifications inherent to the deployment environment.
In smart terminals and interactive systems, the processing unit, graphics processor, and multimedia functionalities enable support for embedded user interfaces and video-centric operations.
Regarding edge artificial intelligence applications, the module establishes a technical platform for executing compatible machine learning inference tasks at the point of data collection. Development teams should conduct early assessment of the intended neural network model and computational framework to verify that the necessary computational operations and optimization mechanisms are available.
These applications represent illustrative examples of feasible integration possibilities rather than an assurance that all configurations will accommodate all capabilities without supplementary development effort.

Portworld OEM and ODM Services for YC-Core3576 Projects
A core board represents merely a single component within a comprehensive embedded product. Successful implementation requires additional elements including the carrier board, software platform, peripheral drivers, enclosure design, thermal management, and rigorous validation procedures.
Portworld delivers OEM and ODM development support for organizations designing specialized embedded computing solutions. Contingent upon specific project needs, technical services may encompass PCB and PCBA modifications, carrier-board engineering, interface connectivity, Android or Linux software customization, BSP and SDK provisioning, and integrated hardware-software solutions.
Employing the YC-Core3576 as the processing module enables development teams to construct an efficient RK3576-based infrastructure while concentrating customization efforts on the particular interfaces and capabilities demanded by the intended application.
The Portworld YC-Core3576 constitutes a 38 × 38 mm Rockchip RK3576 system-on-module incorporating an octa-core processor, Mali-G52 graphics processing unit, embedded artificial intelligence neural processing unit, 4K@120fps video decompression capability, 16 MP image signal processor, 240-pin BTB interface, 12-layer printed circuit board, and integrated RK806S-5 power distribution management. It is designed for compact edge artificial intelligence applications, machine vision systems, industrial embedded computing devices, and multimedia processing solutions.